2009 Microchip Technology Inc.
DS39689F-page 49
PIC18F2221/2321/4221/4321 FAMILY
5.2
Master Clear (MCLR)
The MCLR pin provides a method for triggering an
external Reset of the device. A Reset is generated by
holding the pin low. These devices have a noise filter in
the MCLR Reset path which detects and ignores small
pulses.
The MCLR pin is not driven low by any internal Resets,
including the WDT.
In PIC18F2221/2321/4221/4321 family devices, the
MCLR input can be disabled with the MCLRE Configu-
ration bit. When MCLR is disabled, the pin becomes a
LATE Registers” for more information.
5.3
Power-on Reset (POR)
A Power-on Reset pulse is generated on-chip
whenever VDD rises above a certain threshold. This
allows the device to start in the initialized state when
VDD is adequate for operation.
To take advantage of the POR circuitry, tie the MCLR
pin through a resistor (1 k
Ω to 10 kΩ) to VDD. This will
eliminate external RC components usually needed to
create a Power-on Reset delay. A minimum rise rate for
VDD is specified (parameter D004). For a slow rise
time, see Figure 5-2.
When the device starts normal operation (i.e., exits the
Reset
condition),
device
operating
parameters
(voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
Power-on Reset events are captured by the POR bit
(RCON<1>). The state of the bit is set to ‘0’ whenever
a POR occurs; it does not change for any other Reset
event. POR is not reset to ‘1’ by any hardware event.
To capture multiple events, the user manually resets
the bit to ‘1’ in software following any POR.
FIGURE 5-2:
EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW VDD POWER-UP)
Note 1: External Power-on Reset circuit is required
only if the VDD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when VDD powers down.
2: R < 40 k
Ω is recommended to make sure that
the voltage drop across R does not violate
the device’s electrical specification.
3: R1
≥ 1 kΩ will limit any current flowing into
MCLR from external capacitor C, in the event
of MCLR/VPP pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
VDD
MCLR
PIC18FXXXX
VDD
相关PDF资料
PIC18F4682T-I/ML IC PIC MCU FLASH 40KX16 44QFN
PIC24HJ128GP306T-I/PT IC PIC MCU FLASH 128KB 64TQFP
PIC24FJ96GA008T-I/PT IC PIC MCU FLASH 96KB 80TQFP
PIC24FJ64GA010T-I/PT IC PIC MCU FLASH 64KB 100TQFP
PIC24FJ64GA008T-I/PT IC PIC MCU FLASH 64KB 80TQFP
PIC18LF4450T-I/PT IC PIC MCU FLASH 8KX16 44TQFP
PIC18LF2450T-I/ML IC PIC MCU FLASH 8KX16 28QFN
PIC16F1937-I/ML IC PIC MCU FLASH 512KX14 44-QFN
相关代理商/技术参数
PIC18F2320-E/SO 功能描述:8位微控制器 -MCU 8KB 512 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2320-E/SP 功能描述:8位微控制器 -MCU 8KB 512 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2320-I/SO 功能描述:8位微控制器 -MCU 8KB 512 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2320-I/SO 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 18F2320 SOIC28
PIC18F2320-I/SP 功能描述:8位微控制器 -MCU 8KB 512 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2320-I/SP 制造商:Microchip Technology Inc 功能描述:IC 8BIT FLASH MCU 18F2320 SDIL28
PIC18F2320T-I/SO 功能描述:8位微控制器 -MCU 8KB 512 RAM 25 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F2321-E/ML 功能描述:8位微控制器 -MCU 8KB FLSH 512BRAM 8B nanoWatt RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT